HDB3/HSB3

Product HDB3/HSB3 Product HDB3/HSB3

Contact:

Cat Brandas
Product Manager
+1 (607) 563-5129
cbrandas@amphenol-aao.com

Description:

This connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070” X .060” staggered grid pattern.

Features & Benefits:

  • High Density:
    Up to 160 brush contacts in a tight .070” X .060” staggered grid pattern – allows for a small board footprint.
  • High Speed:
    Data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.
  • Mating Cycles:
    100K mating cycles vs. 2K for competitive connectors.
  • Low insertion/extraction force:
    1.5 ounce typical per contact.
  • Resistant to shock, vibration & fretting corrosion.
  • Low cost for a high level of performance.
Connector Options

Performance Specifications

How to Order Guides and Dimensions


HSB Arrangements

Performance and Materials

  • Durability:
    100,000 mating cycles
  • Insertion/Extraction Force:
    1.5 ounce typical per contact
  • Operating Temperature:
    -65° to 125°C
  • Current Rating:
    2 amperes Hot-swap 1 ampere maximum (load dependent)
  • Insulation Resistance:
    5 gigaohms minimum
  • Dielectric Withstanding Voltage:
    750 volts, 60 hertz, rms @ Sea Level, 250 volts, 60 hertz, rms @ 70,000 feet elevation
  • Solderability:
    MIL-STD-202, Method 208
  • Salt Fog:
    48 Hours IAW MIL-STD-1344, method 1001, test condition B
  • Humidity:
    IAW MIL-STD-1344, method 1002, type II
  • Vibration:
    4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H
  • Shock:
    1 shock along each of three mutually perpendicular axes    IAW MIL-STD-1344, method 2004, test condition G
  • Data Rate (HSB3):
    Capable of 6.250 Gbps (consult Amphenol for arrangement)
PCB Layouts


Assembly Tools

HDB3/HSB3 Catalog Section
Incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors.
Board Level and Rectangular Interconnects Catalog
Board Level and Rectangular products includes LRM, Ruggedized VME 64x/VITA 60, 66, High Density HDB3 & HSB3, Low Mating Force, Rack & Panel Brush, LMD/LMS and more.
HDB3 Heat Rise Testing
Application of various Current Levels and their corresponding heat rise.
HSB3 Signal Integrity Analysis
HSB3 SI analysis DB to MB showing performance up to 6.25Gb/s
HDAS
High-performance high-density board to board connector series.
MIL-DTL-55302 Low Mating Force Connectors
Utilizes the B³ brush contact system known for low mating force, stable electrical performance in high vibration, and extended service life.
Amphenol Advantage IconComplementary External Product Micro HDAS
Micro HDAS
The 1.27mm pitch connector. Smaller, lighter & still as strong.
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