MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series

Product MIL-HD2 Product MIL-HD2

Contact:

Cat Brandas
Product Manager
+1 (607) 563-5129
cbrandas@amphenol-aao.com

Description:

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56Gb/s PAM 4 speeds. This series was selected by the SOSA Consortium and provides a SOSA aligned solution for nextgen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements. 

Configurations to meet SOSA/VITA 91 requirements for HD Switch

 

Features & Benefits:

  • Highest density with 1.80mm pitch
  • 4 diff, 8 column - SOSA aligned configuration
  • Data rates scalable to 56Gb/s PAM4 to support system 
    upgrades without costly redesigns
  • Proprietary crosstalk reducing technologies
  • 15.7mil drill compliant pin allows deeper backdrilling
  • Optimized footprints
  • Shielded contacts mate before signal contacts, 
    providing up to a 4mm minimum wipe
  • Embedded capacitor available
  • Differential pairs 28-84 per inch (11-33 differential pairs 
    per centimeter)
  • Proven EMI and signal integrity advantages
  • Improved impedance matching
  • Complete solution for unique customer requirements
  • Enables hot plugging
  • Meets high density application requirements
Mil HD2 Product Data Sheet
Mil HD2 Product Data Sheet
CE23-0102_A
CE23-0102_A
CE23-0103_A
CE23-0103_A
CE23-0104_A
CE23-0104_A
CE23-0105_A
CE23-0105_A
CE23-0106_A
CE23-0106_A
Video MIL-HD2: The Future of Advanced Connectivity
MIL-HD2: The Future of Advanced Connectivity
2:23
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